The INFINITE flagship bonder from ASMPT Semiconductor Solutions integrates intelligent iSense and iTouch modules to deliver placement accuracy and throughput. Capable of up to 18,500 units per hour, it handles dies from 0.2Ã0.2 to 9Ã9 mm. Automated glue dispensing and bond-force control optimize process consistency and yield. An internal AI-driven feedback loop calibrates speed, pattern, and height in under 30 minutes, minimizing setup time while ensuring peak quality and efficiency.
Table of Contents: What awaits you in this article
ASMPT INFINITE Bonder Enables Advanced Packaging Beyond Moore’s Limits
According to Dr. Gary Widdowson of ASMPT Semiconductor Solutions, the traditional pace of transistor scaling is reaching inevitable physical and financial barriers. In response, future performance gains will depend more heavily on advanced packaging innovations than on further shrinking of individual components. ASMPTs new flagship bond operator, INFINITE, is engineered to address these evolving needs by enabling manufacturers to execute sophisticated semiconductor assembly and highâdensity packaging processes efficiently, reliably, scalably.
INFINITE Bonder Delivers 18,500 UPH with Submicron Placement Precision
The INFINITE bonder delivers productivity with throughput rates up to 18,500 units per hour. It ensures reliable placement with X-Y accuracy of ±20 μm (3Ï) in Standard Mode and ±12.5 μm (3Ï) in High Precision Mode. Capable of handling dies ranging from 0.2Ã0.2 to 9Ã9 millimeters in footprint and thicknesses between 0.075 and 1.0 millimeter, it supports bond forces from 0.196 to 29.43 newtons and substrates up to 300Ã100 millimeters.
iSense inspects placements, automates adhesive dispensing in thirty minutes
iSense examines each die placement site for uneven surfaces and warping, ensuring optimal adhesive dispensing preparation. Users simply specify epoxy type, bond line thickness, and fillet height. An ASMPT AI system automatically calculates dispensing speed, pattern layout, and deposit height. It conducts noncontact measurements to evaluate surface topology and iteratively adjusts parameters within a closed feedback loop. Typical rapid system calibration and full operational readiness are completed in thirty minutes.
iTouch precisely controls bond forces for SiC, GaN dies
iTouch continuously monitors and adjusts bonding force throughout each placement sequence, enabling reliable processing of ultra-thin silicon carbide or gallium nitride dies. By integrating high-resolution force sensors and real-time feedback algorithms, it maintains consistent bond parameters regardless of substrate or handling variations. This precise force control ensures optimal compression of silver sinter paste, fostering uniform fillet formation while minimizing stress on components. The result is uncompromised assembly yield and integrity.
INFINITE Bonder Optimizes BGA, LGA, SiP, MEMS, QFN Packaging
INFINITE is engineered to handle a broad spectrum of packaging formats including Ball Grid Array, Land Grid Array, System in Package, Microelectromechanical Systems and Quad Flat No-lead. Its adaptability makes it ideal for assembling critical components for 5G communications infrastructure, high-performance artificial intelligence accelerators, safety-critical automotive control units and medical diagnostic modules. The system seamlessly integrates with automated production lines, ensuring high throughput and minimal downtime for semiconductor assembly operations.
ASMPT SEMI Delivers Advanced Packaging Solutions With Enhanced Efficiency
ASMPT Semiconductor Solutions (ASMPT SEMI) is a pioneer in advanced packaging and semiconductor assembly, delivering innovative solutions that support modern electronics manufacturing. Its broad global product range includes flip-chip and wafer-level packaging, as well as cutting-edge interconnect technologies tailored for high-volume production. Clients achieve substantial gains in device performance, reliability, and cost-efficiency by leveraging ASMPT SEMIs expertise and scalable, industry-leading platforms. To explore their offerings and technical resources, visit semi.asmpt.com.
ASMPT INFINITE Bonder Enables High Throughput, Precision, Intelligent Automation
ASMPTs INFINITE Bonder merges exceptional throughput rates with placement precision, leveraging advanced automation modules to streamline production workflows. Equipped with intelligent iSense and iTouch systems, it conducts continuous feedback loops for adhesive deposition and force control, significantly reducing setup times. Its versatile die handling and packaging compatibility accommodate a broad spectrum of material types and form factors, enabling high-volume manufacturing environments to consistently achieve quality standards while maintaining cost-effective operations.
