DATA MODUL unveils rugged Pico-ITX eDM-SBC-iMX95 for industrial edge

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Embedded world in Nuremberg, DATA MODUL showcases the eDM-SBC-iMX95, a Pico-ITX computer based on the NXP i.MX95 Application Processor Series. Featuring a hexa-core ARM Cortex-A55, up to 16 GB LPDDR5 and 128 GB eMMC, it offers dual Gigabit Ethernet with TSN, five USB ports, two CAN channels and RS232/422/485. Three M.2 slots support Wi-Fi, cellular or NVMe. Components -40 °C to +85 °C tolerance ensure reliable IoT and edge computing.

DATA MODUL unveils eDM-SBC-iMX95 Pico-ITX SBC with Hexa-Core Cortex-A55

The eDM-SBC-iMX95 is a compact Pico-ITX single-board computer featuring an NXP i.MX95 Application Processor with a hexa-core ARM Cortex-A55 architecture. It supports up to 16 GB of LPDDR5 RAM and offers 128 GB eMMC storage. Designed for harsh industrial environments, it operates between -40 °C and +85 °C. Equipped with multiple interfaces, including Gigabit Ethernet with TSN, USB, CAN, and RS232/422/485, it ensures reliable performance and availability for embedded applications.

Compact Pico-ITX SBC with Wide Temperature Range Ensures Reliability

With its proven 100 x 72 mm Pico-ITX footprint, the eDM-SBC-iMX95 integrates a compact, rugged chassis designed for harsh environments. Operating reliably between -40 °C and +85 °C, it ensures functionality in industrial and outdoor applications. By leveraging long-term available components, DATA MODUL secures consistent production lifecycles and simplifies maintenance planning. This durable design addresses temperature and supply stability requirements, delivering high availability and performance across diverse IoT edge scenarios.

Hexa-core Cortex-A55 SBC with 16GB LPDDR5, 128GB eMMC memory

At its core, the board employs a hexa-core ARM Cortex-A55 processor from NXPs i.MX95 series, enabling efficient edge processing. It supports up to 16 GB of soldered LPDDR5 DRAM and up to 128 GB of eMMC storage, supplemented by a micro-SD slot for capacity. Graphics and vision interfaces include LVDS, MIPI-DSI, and MIPI-CSI. Robust Connectivity features comprise two Gigabit Ethernet with TSN, five USB ports, two CAN channels, and industrial RS-232/422/485 interfaces.

Three M.2 Slots Deliver Flexible WiFi, Cellular, NVMe Expansion

Featuring three versatile M.2 slots within its compact form factor, the board enables seamless integration of wireless connectivity modules, cellular radios, and NVMe storage. This expansion architecture provides engineers with the freedom to customize networking and data processing capabilities according to specific IoT and edge computing requirements. By accommodating a variety of M.2 add-ons, the design unlocks applications ranging from advanced Smart Factory automation and asset tracking to real-time predictive maintenance.

eDM-SBC-iMX95 launch alongside NXP i.MX95 Series in early 2026

The eDM-SBC-iMX95 will ship concurrently with the official NXP i.MX95 Series launch in Q1 2026. Starting immediately, customers may reserve the board through DATA MODULs pre-order system. Complete specifications and ordering instructions are accessible at www.data-modul.com. Visitors seeking in-person consultation can experience demos at embedded world 2026 between March 10 and 12 on booth 368 in hall 1. This opportunity ensures early access to the latest SBC platform developments.

DATA MODUL SBC offers Hexa-Core power, rugged modular IoT

The DATA MODUL eDM-SBC-iMX95 integrates a Pico-ITX form factor with a hexa-core NXP i.MX95 processor, up to 16 GB LPDDR5 memory and 128 GB eMMC. It features dual Gigabit Ethernet with TSN, multiple USB ports, CAN and serial interfaces, MIPI-CSI, MIPI-DSI and LVDS for graphics. Three M.2 slots support wireless and NVMe modules. Rated for -40 °C to +85 °C, it ensures reliable performance in demanding IoT and edge applications.

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