Between March 17 and 19 at the APEX Expo 2026 in Anaheim, ASMPT SMT Solutions, ASMPT Semiconductor Solutions and Critical Manufacturing will unveil electronics manufacturing innovations. Highlights include the SIPLACE V high-speed pick-and-place platform, the DEK TQ XL large-format solder-paste printer and advanced software for intelligent production. Complementary high-performance bonders complete the lineup. At booth 1813, visitors can directly experience complete SMT production lines with seamlessly integrated hardware and software.
SIPLACE V Delivers Up to Thirty Percent Production Performance
Die neue SIPLACE V Plattform (Foto: ASMPT)
Introduced at productronica 2025, the SIPLACE V SMT placement platform boosts throughput by up to thirty percent in production. It handles components from tiny 016008M chips to large odd-shaped parts and offers ninety feeder slots. Despite expanded capability, its compact 1.1 Ã 2.4 meter footprint integrates with existing SMT lines. Gigabit Ethernet supports big data, AI-driven automation, and advanced analytics. SIPLACE V L model adapts to larger PCB formats.
The DEK TQ XL solder paste printer accommodates oversized printed circuit boards measuring up to 850 Ã 610 millimeters, enabling accurate paste deposition on the board surface. Designed for manufacturing, it compensates for board warpage up to 4 millimeters and maintains consistent printing results. Its modular architecture integrates seamlessly within existing SMT production lines, while controls and low maintenance requirements reduce downtime and improve throughput, ensuring reliable reproducibility and enhanced traceability.
This paste printer accommodates boards measuring up to 850 x 610 mm and supports thicknesses up to 8 mm, handling weights of 12 kg without compromising performance. Covering the entire board surface, it consistently delivers uniform paste deposits even on warped panels up to 4 mm. As a module in the DEK TQ family, it integrates seamlessly into existing SMT lines. Operators benefit from intuitive controls and minimal maintenance requirements.
ASMPT unveils complete SMT line: SIPLACE V, DEK TQ
Die DEK TQ Plattform, mit ihren drei Versionen DEK TQ, DEK TQ L (Foto: ASMPT)
At the exhibition booth, ASMPT presents a fully integrated SMT production line featuring the SIPLACE V placement platform, the DEK TQ L solder paste printer, and the Process Lens SPI inspection system. The setup is complemented by the proven SIPLACE SX with an enhanced OSC Package. This configuration achieves precise handling of large-volume special components, including ball grid arrays and complex packages, while meeting specifications for geometry, weight, and coplanarity.
By integrating the WORKS Software Suite, Factory Equipment Center, and SMT Analytics, manufacturers achieve centralized control of production workflows. This unified solution connects asset management, maintenance scheduling, quality inspection, and data analytics. AI-powered reporting generates real-time insights into equipment performance, material traceability, and product quality. Automated alerts and dashboards enable proactive decision making, reduce downtime, optimize throughput, and improve operational transparency. Scalable architecture adapts to changing shopfloor requirements, enhancing efficiency.
By integrating the WORKS Software Suite, manufacturers gain centralized control over every shopfloor operation within SMT production environments. Its asset and maintenance management module, the Factory Equipment Center, monitors equipment health and schedules preventive actions to maximize uptime. Complementing this, SMT Analytics delivers detailed process insights and AI-powered reporting, facilitating real-time performance tracking. Collectively, these applications foster transparent workflows, enable data-driven decision-making, and enhance overall manufacturing efficiency, reliability, operational stability.
Critical Manufacturings MES platform provides comprehensive visibility and control across electronics production processes. By integrating real-time monitoring, flexible scheduling, and reporting tools, it enables manufacturers to optimize resource allocation and minimize downtime. Seamless connectivity with shopfloor equipment ensures accurate data collection and process traceability, while configurable workflows support quality compliance and continuous improvement. The platforms modular architecture and user-friendly interface facilitate rapid deployment and scalable operations for evolving manufacturing needs.
Critical Manufacturings Manufacturing Operations Platform, showcased at the exhibition, is a specialized MES solution engineered for electronics production environments. By delivering comprehensive, oversight of every stageâfrom material reception through assembly and testingâit ensures process integrity and operational efficiency. Real-time data acquisition feeds customizable dashboards, while adaptable scheduling modules streamline resource allocation. Robust analytics and reporting capabilities further enable deep process insight, fostering informed decision-making and heightened transparency across the shopfloor.
ASMPT Semiconductor Solutions demonstrates high-performance bonders designed for precision die attach processes and advanced packaging systems that accommodate increasing component densities. Its hybrid bonding modules deliver high accuracy, while thermal control units maintain optimal processing conditions for sensitive substrates. With tool heads and inline metrology, these platforms support fan-out wafer-level packaging, multi-chip modules, and system-in-package architectures. Integrated automation and real-time monitoring enable consistent throughput and reliability in next-generation semiconductor applications.
At ASMPT Semiconductor Solutions exhibition area, visitors encounter high-performance bonding equipment and cutting-edge advanced packaging technologies tailored for semiconductor manufacturing demands. These innovations address critical industry challenges such as rising integration densities, accelerated development cycles, and stringent quality and reliability requirements. The portfolio also includes hybrid placement platforms like SIPLACE CA2, which offer versatile packaging capabilities. This expanded offering empowers manufacturers to adapt to evolving packaging specifications and production environments.
ASMPT Unveils SIPLACE V, DEK TQ XL, Software Suite
By integrating the SIPLACE V placement platform, the DEK TQ XL solder paste printer and a truly comprehensive software suite, ASMPT delivers end-to-end solutions that enhance efficiency, flexibility and future readiness in electronics assembly. Close integration between hardware and software components drives production throughput improvements, consistent quality and automation workflows, including AI-powered process monitoring. Semiconductor manufacturers also gain from cutting-edge bonders and advanced packaging technologies specialized for complex, high-density applications.
