congatec recently introduced six new highly robust COM Express Compact Computer-on-Modules based on the 13th generation Intel Core processors. These modules are specifically designed to withstand extreme temperatures ranging from -40Â°C to +85Â°C. With soldered RAM, the COM Express Type 6 Computer-on-Modules meet all requirements for shock and vibration resistance, even in harsh environments that comply with the highest railway standards.
New Computer-on-Module for Rugged Mobility and Critical Infrastructure Applications
The new computer-on-module series, based on Intel’s Raptor Lake microarchitecture, is ideal for a wide range of applications, including manned and unmanned vehicles used in mining, construction, agriculture, and other off-road mobility applications. These modules are also well-suited for stationary devices and outdoor applications that require resistance to shock, vibrations, and extreme temperature fluctuations. They are especially critical for digitalizing critical infrastructures, such as earthquake-prone areas, where resilience against mission-critical events is of utmost importance.
The 13th generation Intel Core processors deliver exceptional parallel processing and multitasking capabilities for connected outdoor, rail, and off-road applications. With up to 14 cores, 20 threads, and ultra-fast LPDDR5x memory, these processors optimize power consumption while providing outstanding performance. Their improved performance-per-watt ratio and lower lifetime power costs contribute to more sustainable system designs.
The Intel-Hybrid architecture, available for the first time in an extremely robust design, combines Performance-Cores (P-Cores) and Efficient-Cores (E-Cores) on a single processor. Additionally, the soldered LPDDR5x memory supports In-Band Error-Correcting Code (IBECC), eliminating the need for specialized memory in even the most data-intensive business-critical applications. This not only enhances data integrity but also reduces the number of required components. Furthermore, the support for Time Sensitive Networking (TSN) and Time Coordinated Computing (TCC) completes the feature set suitable for industrial applications.
The new modules are backed by congatec’s High-Performance Ecosystem, which provides efficient active and passive cooling solutions, optional protective coatings to safeguard against moisture, temperature shocks, static discharge, vibrations, and contamination, as well as evaluation carrier boards and their corresponding schematics.
Customers have the option to purchase the modules with pre-evaluated real-time hypervisor technology from Real-Time Systems, enabling the provision of virtual machines and workload consolidation in edge computing scenarios. This hypervisor supports real-time operation without any additional latency. Moreover, congatec offers additional services such as shock and vibration testing for custom system designs, temperature screening, high-speed signal compliance testing, as well as design-in services and training, simplifying the implementation of congatec’s embedded computer technologies.
The new ultra-robust congatec computer-on-modules, based on the Intel Core processors of the 13th generation, offer a multitude of advantages. These modules are designed to withstand extreme temperatures and comply with shock and vibration resistance requirements, making them suitable for a wide range of applications across various industries. With their powerful processors, they deliver excellent parallel processing and multitasking capabilities while optimizing power consumption.
The robust design and soldered RAM ensure high data integrity and reduce the number of required components. Additionally, congatec’s High-Performance Ecosystem supports easy integration and utilization of the computer-on-modules through its extensive service offerings. Overall, these new modules are an ideal solution for demanding embedded and edge computing applications.