Kontron introduces high-performance COM-HPC server modules for Edge Computing

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The COMh-sdID Server module from Kontron is a high-performance solution for demanding edge computing applications. With its compact size of 160 x 160 mm, it offers impressive scalability of 4 to 20 cores. The module features 4x DIMM sockets supporting up to 512 GB DDR4 memory at a speed of 3200 MT/s. Additionally, it offers an optional soldered NVMe SSD with a capacity of up to 1 TB. With 48 PCIe lanes and 2 quad-LAN interfaces supporting up to 100 Gbit Ethernet, the COMh-sdID provides extensive interface and communication capabilities for versatile applications.

Kontron’s COMh-sdID Server Module: Ideal Solution for High-End Edge Computing

The COMh-sdID Server Module from Kontron is an ideal solution for high-end edge computing applications. With dimensions of 160 x 160 mm, it offers impressive scalability from 4 to 20 cores. The module features 4x DIMM sockets for up to 512 GB of DDR4 memory running at a speed of 3200 MT/s. Additionally, it offers an optional soldered NVMe SSD with a capacity of up to 1 TB. With 48 PCIe lanes and 2 quad-LAN interfaces supporting up to 100 Gbit Ethernet, the COMh-sdID provides extensive interface and communication options for versatile applications.

Compact and Robust Edge Computing Solution by Kontron

The COMh-sdIL server module from Kontron is a compact and robust solution designed for edge computing applications. With dimensions of 120 x 160 mm in the “Size D small” format, it offers a space-saving form factor. All components are soldered, making the module resistant to shocks and vibrations, making it ideal for outdoor applications. It features 16 PCIe Gen4 and 16 PCIe Gen3 lanes, along with a maximum of 64 GB soldered DDR4 memory running at 2933 MT/s. Additionally, an optional soldered NVMe SSD with up to 1 TB storage capacity is available. The COMh-sdIL module combines compactness with robustness, meeting the requirements of demanding edge computing environments.

Robust and Compact: Kontron’s COMe-bID7 Module for Demanding Environments

The COMe-bID7 COM-Express(R) module from Kontron is a rugged and space-saving solution designed for demanding environments. With its Intel(R) Xeon(R) D-1800 processor, it offers scalability from 4 to 10 cores on a small form factor. The module features up to 4x SO-DIMM sockets for a maximum of 128 GB memory. An optional soldered NVMe SSD with up to 1 TB storage capacity is available. With 16 PCIe Gen4 plus 16 PCIe Gen3 lanes and 4x 10GBASE-KR interfaces, the COMe-bID7 provides ideal support for high data throughput in demanding I/O and networking structures. It is the perfect choice for robust implementations in challenging environments.

Robust modules by Kontron provide reliable performance in harsh environments

The robust performance of Kontron’s three modules makes them well-suited for the most demanding environments. Designed to operate in an extended industrial temperature range of -40 °C to +85 °C, these modules offer 24/7 reliability over a period of 10 years. With scalable performance supported by Intel(R) QuickAssist Technology (QAT) and AI acceleration with Intel(R) AVX-512, these modules are perfect for complex AI applications, high-performance network platforms, and edge servers. Additionally, their real-time capabilities, low latency, and determinism enabled by Intel(R) Time Coordinated Computing (TCC) and Time Sensitive Networking (TSN) make them an ideal choice for high-performance IoT edge computing applications.

Kontron’s new Embedded-IoT solutions provide application developers with exceptional scalability and flexibility. These modules offer a powerful and reliable solution for demanding Edge Computing applications. Whether in high-end Edge Computing applications, outdoor environments, or rugged implementations, Kontron’s modules meet the requirements of the modern IoT world and enable innovations at the highest level.

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